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3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces ...
cavity down  memory stacking  multi chip package  substrate design 
www.broadpak.com - 2009-02-11
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Sohar Inc. designs, evaluates, and develops applications for software and hardware reliability, logistics and safety
analysis costing cycle life  network analysis system 
www.cost-commander.com - 2009-02-13
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QualStat Solutions is dedicated to helping organizations achieve their goals by ensuring success in their quality, reliability, and process improvement ...
qualstatsolutions.com - 2009-04-09
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